Semiconductor device and method for manufacturing the same

ABSTRACT

A method for manufacturing a semiconductor device comprises: forming a circuit pattern and a first metal film on a first major surface of a body wafer; forming a through-hole penetrating the body wafer from a second major surface of the body wafer and reaching the first metal film; forming a second metal film on a part of the second major surface of the body wafer, on an inner wall of the through-hole, and on the first metal film exposed in the through-hole; forming a recess on a first major surface of a lid wafer; forming a third metal film on the first major surface of the lid wafer including inside the recess of the lid wafer; with the recess facing the circuit pattern, and the first metal film contacting the third metal film, joining the lid wafer to the body wafer; and dicing the joined body wafer and lid wafer along the through-hole.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor device and a method formanufacturing the same wherein a lid wafer having a recess is joined toa body wafer having a circuit pattern.

2. Background Art

In recent years, applications using millimeter wave band, such as 60GHz-band WPAN (Wireless Personal Area Network) and 76 GHz-band on-boardmillimeter wave radars, have been increased. These applications needsemiconductor devices having high gain in millimeter wave band. Althougha semiconductor device wherein semiconductor chips are sealed with amold can reduce manufacturing costs, parasitic capacitance increases andthe performance of the device deteriorates. In particular, the quantityof deterioration is marked in the millimeter wave band. In addition, themoisture resistance is not sufficiently maintained. Therefore, asemiconductor device wherein a lid wafer having a recess is joined to abody wafer having a circuit pattern formed has been proposed. Thereby,the circuit pattern is air-tightly sealed to improve moistureresistance, and gain lowering by parasitic capacitance can be repressed.

Furthermore, there is a problem wherein if a part of signals are fedback in a device, undesired oscillation is generated in the amplifier,or oscillation signals become misaligned in the oscillator.Particularly, since millimeter waves have short wavelength, selfinterference cannot be ignored. Therefore, a semiconductor devicewherein an electromagnetic shield is provided on the inner surface of alid wafer for covering the circuit pattern has been proposed (forexample, refer to FIG. 11 in Japanese Patent Laid-Open No. 2005-57136).

Further, a semiconductor device wherein a circuit pattern is provided onthe inner surface of a lid wafer and is connected to the circuit patternof a body wafer has also been proposed (for example, refer to FIG. 10 inJapanese Patent Laid-Open No. 2005-57136). Thereby, the chip size can bereduced.

SUMMARY OF THE INVENTION

The body wafer and the lid wafer are joined in a vacuum by plasmaactivation joining or the like. At this time, the chip may dent due todifference between the atmospheric pressures of inside and outside ofthe device. In this case, distances to the circuit pattern and to thelid change, and problems of the gap between the designed value and theactual value are caused. In order to prevent these problems, the bodywafer or the lid wafer must be thickened. Therefore, the dicing accuracyis lowered, the dicing speed (throughput) is lowered, and the bladecosts are increased. Furthermore, the dicing line must be widened, andthe number of chips per wafer is reduced.

Although a semiconductor device having a reduced chip size by providingthe circuit pattern on the inner surface of the lid wafer has also beenproposed, the further reduced chip size is required.

The emitter of the HBT formed on the body wafer was also grounded, andthe heat was dissipated via the through-hole of the air bridge and thebody wafer. Therefore, there was a problem wherein poor heat dissipationand high parasitic inductance.

Heretofore, in order to prevent change in the oscillation frequency ofthe oscillator by the output signals of the amplifier, the amplifier andthe oscillator were formed on separate chips, and an electromagneticshield was provided inside the lid wafer of either chip. However, therewas a problem of increase in the device size and manufacturing costs.

In order to solve the above-described problems, the first object of thepresent invention is to obtain a method for manufacturing asemiconductor device that can improve moisture resistance, suppress gainlowering, prevent exterior electromagnetic noise, and efficientlyperform dicing. The second object of the present invention is to obtaina semiconductor device that can reduce the chip size. The third objectof the present invention is to obtain a semiconductor device that canimprove heat dissipation and lower parasitic inductance. The fourthobject of the present invention is to obtain a semiconductor device anda method for manufacturing the same that can prevent exteriorelectromagnetic noise, and reduce the device size and the manufacturingcosts.

According to the present invention, a method for manufacturing asemiconductor device comprises: forming a circuit pattern and a firstmetal film on a first major surface of a body wafer having the firstmajor surface and a second major surface facing to each other; forming athrough-hole penetrating the body wafer from the second major surface ofthe body wafer and reaching the first metal film; forming a second metalfilm on a part of the second major surface of the body wafer, on aninner wall of the through-hole, and on the first metal film exposed inthe through-hole; forming a recess on a first major surface of a lidwafer having the first major surface and a second major surface facingto each other; forming a third metal film on the first major surfaceincluding inside the recess of the lid wafer; making the recess to faceto the circuit pattern, making the first metal film to contact the thirdmetal film, and joining the lid wafer to the body wafer; and dicing thejoined body wafer and lid wafer along the through-hole.

The present invention makes it possible to obtain a method formanufacturing a semiconductor device that can improve moistureresistance, suppress gain lowering, prevent exterior electromagneticnoise, and efficiently perform dicing.

Other and further objects, features and advantages of the invention willappear more fully from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing a semiconductor device according to thefirst embodiment.

FIG. 2 is a sectional view taken along the line A-A′ in FIG. 1.

FIG. 3 is a sectional view taken along the line B-B′ in FIG. 1.

FIGS. 4 to 12 are sectional views for illustrating a method formanufacturing a semiconductor device according to the first embodiment.

FIGS. 13 to 18 are sectional views for illustrating the method formanufacturing a semiconductor device according to the second embodiment.

FIGS. 19 to 26 are sectional views for illustrating the method formanufacturing a semiconductor device according to the third embodiment.

FIG. 27 is a sectional view showing a semiconductor device according tothe fourth embodiment.

FIG. 28 is a sectional view showing a semiconductor device according tothe fifth embodiment.

FIG. 29 is a circuit diagram of a semiconductor device according to thefifth embodiment.

FIG. 30 is a sectional view showing a semiconductor device according tothe sixth embodiment.

FIG. 31 is a sectional view showing a semiconductor device according tothe seventh embodiment.

FIG. 32 is a plan view showing a semiconductor device according to theeighth embodiment.

FIG. 33 is a sectional view taken along the line A-A′ in FIG. 32.

FIG. 34 is a sectional view taken along the line B-B′ in FIG. 32.

FIG. 35 is a sectional view taken along the line C-C′ in FIG. 32.

FIGS. 36 to 43 are sectional views for illustrating the method formanufacturing a semiconductor device according to the eighth embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A semiconductor device and a method for manufacturing the same accordingto the embodiments of the present invention will be described withreference to the drawings. The same components will be denoted by thesame symbols, and the repeated description thereof may be omitted.

First Embodiment

FIG. 1 is a plan view showing a semiconductor device according to thefirst embodiment. FIG. 2 is a sectional view taken along the line A-A′in FIG. 1. FIG. 3 is a sectional view taken along the line B-B′ in FIG.1.

A body wafer 1 has a major surface 1 a and a major surface 1 b facing toeach other. A circuit pattern 2 and a metal film 3 are formed on themajor surface 1 a of the body wafer 1.

A metal film 4 is formed on the side surface of the body wafer 1 and apart of the major surface 1 b, and the metal film 4 is connected to themetal film 3. A pad 5 for inputting/outputting signals is formed on themajor surface 1 b of the body wafer 1. The pad 5 forinputting/outputting signals is connected to the circuit pattern 2 bypenetrating electrodes 6 penetrating through the body wafer 1.

The circuit pattern 2 is a circuit pattern for an amplifier and anoscillator, and has transistors, resistors, MIM capacitors, spiralinductors, wirings and the like. The through-holes of the penetratingelectrodes 6 are filled with gold for reducing parasitic inductance andthermal resistance. In addition, although not shown in the drawings,penetrating electrodes and pads for grounding the circuit are alsoformed.

A lid wafer 7 has a major surface 7 a and a major surface 7 b facing toeach other. A recess 8 is formed on the major surface 7 a of the lidwafer 7. A metal film 9 is formed on the major surface 7 a of the lidwafer 7 including inside the recess 8. The lid wafer 7 is joined to thebody wafer 1 with the recess 8 facing to the circuit pattern 2, and withthe metal film 9 contacting to the metal film 3.

The metal film 4 on the major surface 1 b of the body wafer 1 isconnected to the grounding line 12 on the substrate 11 via the groundingbump 10. The pad 5 for inputting/outputting signals on the major surface1 b of the body wafer 1 is connected to the signal line 14 on thesubstrate 11 via the bump 13 for inputting/outputting signals.

Next, a method for manufacturing a semiconductor device according to thefirst embodiment will be described. FIGS. 4 to 12 are sectional viewsfor illustrating a method for manufacturing a semiconductor deviceaccording to the first embodiment.

First, as shown in FIG. 4, a circuit pattern 2 and a metal film 3 areformed on the major surface 1 a of a body wafer 1.

Next, as shown in FIG. 5, a resist pattern 15 is formed on the majorsurface 1 b of the body wafer 1. The body wafer 1 is etched using theresist pattern 15 as a mask. Thereby, a through-hole 16 penetrating thebody wafer 1 and reaching the circuit pattern 2, and a through-hole 17penetrating the body wafer 1 from the major surface 1 b and reaching themetal film 3 are formed.

Next, as shown in FIG. 6, a penetrating electrode 6 is formed by buryinga metal, such as gold, into the through-hole 16.

Next, as shown in FIG. 7, a metal film 4 is formed on a part of themajor surface 1 b of the body wafer 1, an inner wall of the through-hole17, and the metal film 3 exposed in the through-hole 17. Then, a pad 5for inputting/outputting signals is formed on the penetrating electrode6 on the major surface 1 b of the body wafer 1. Since dicing is laterperformed along the through-hole 17, the through-hole 17 is not filledwith the metal film 4. The formation of the metal film 4 on dicing linesmay be omitted.

Next, as shown in FIG. 8, a resist pattern 18 is formed on the majorsurface 7 a of the lid wafer 7. The lid wafer 7 is etched using theresist pattern 18 as a mask. Thereby, recesses 8 are formed on the majorsurface 7 a of the lid wafer 7.

Next, as shown in FIG. 9, a metal film 9 is formed on the major surface7 a including inside the recesses 8 of the lid wafer 7.

Next, as shown in FIG. 10, the recesses is made to face to the circuitpattern 2, the metal film 9 is made to contact the metal film 3, and thelid wafer 7 is joined to the body wafer 1 in a vacuum using plasmaactivation joining. Since the joint of the body wafer 1 with the lidwafer 7 is the same metal material, joining can be performed withthermo-compression bonding, and thermal stress is hard to remain.However, in the case of a semiconductor hard to apply a high-temperatureheat process, such as GaAs, which excels in high-frequencycharacteristics, plasma activation joining, which can join at a lowtemperature, is effective.

Next, as shown in FIG. 11, the joined body wafer 1 and lid wafer 7 aresubjected to dicing along the through-hole 17. Thereby, as shown in FIG.12, a semiconductor device according to the first embodiment ismanufactured.

Next, the effect of the first embodiment will be described. Since thecircuit pattern 2 having a transistor is air-tightly sealed by the lidwafer 7, the moisture resistance thereof can be much improved comparingto a bare chip having no lid. Since conventional chips had ananti-moisture insulating film formed on the transistor, gain was loweredby parasitic components. On the other hand, in the present embodiment,since the part above the transistor is hollow, the lowering of gain dueto parasitic components can be suppressed.

Since the metal film 9 of the lid wafer 7 covering the circuit pattern 2is grounded, the electromagnetic effect can be improved, and theexternal electromagnetic can be prevented. Furthermore, undesiredoscillation or mismatched oscillation frequency can be suppressed.However, since no grounded metal films 3, 4, and 9 are present in thesignal inputting/outputting part, electromagnetic shield isdisconnected. Therefore, the distant L of the grounding bump 10 pinchingthe signal inputting/outputting part is made to be ½ or less thewavelength of the signals. Thereby, the entering of signals into thecircuit pattern 2 can be prevented. For example, since the wavelength of5 mm when the frequency of the signals is 60 GHz, the distant L can be2.5 mm or less.

Since the joined body wafer 1 and lid wafer 7 are subjected to dicingalong the through-hole 17, the wafer thickness can be thinned by thethickness the dicing line. Therefore, dicing can be effectivelyperformed while securing the wafer thickness and preventing the dent ofthe chip. Since no thick dicing blade is required, the width of thedicing line can be thinned, and the number of chips per wafer can beincreased.

Since the body wafer 1 and the lid wafer 7 can be collectively joined inthe state of the wafer, the assembling costs can be significantlyreduced comparing to the case wherein the body wafer 1 and the lid wafer7 are joined chip by chip. Also since the body wafer 1 is mounted on thesubstrate 11 using the bump, no wire is required, and the lowering ofgain and the narrowing of bands can be suppressed.

In addition, by forming the through-holes 16 and 17, the warpage of thebody wafer 1 may be enlarged so as not be installed in the processdevice. In such a case, the through-holes 16 and 17 may be formed afterjoining the body wafer 1 and the lid wafer 7. Although the body wafer 1and the lid wafer 7 are not necessarily formed using the same material,the same material is preferable when warpage due to the difference inexpansion coefficients causes a problem. For protecting the product frommechanical impact during mounting, chip protecting films can be formedon the body wafer 1 and the lid wafer 7.

Second Embodiment

A method for manufacturing a semiconductor device according to thesecond embodiment will be described. FIGS. 13 to 18 are sectional viewsfor illustrating the method for manufacturing a semiconductor deviceaccording to the second embodiment.

First, in the same manner as in the first embodiment, steps shown inFIGS. 4 to 7 are performed. Next, as shown in FIG. 13, a metal film 19and a recess 8 are formed on the major surface 7 a of the lid wafer 7.Next, as shown in FIG. 14, a through-hole 20 penetrating the lid wafer 7from the major surface 7 b of the lid wafer 7 and reaching the metalfilm 19 is formed.

Next, as shown in FIG. 15, a metal film 21 is formed on the majorsurface 7 b of the lid wafer 7, the inner wall of the through-hole 20,and the metal film 19 exposed in the through-hole 20.

Next, as shown in FIG. 16, a recess 8 is made to face to the circuitpattern 2, the through-hole 17 is aligned with the through-hole 20, andthe metal film 3 is made to contact the metal film 19 to join the lidwafer 7 to the body wafer 1.

Next, as shown in FIG. 17, the joined body wafer 1 and the lid wafer 7is subjected to dicing along the through-holes 17 and 20. Thereby, asshown in FIG. 18, the semiconductor device according to the secondembodiment is manufactured.

Next, the effect of the second embodiment will be described. In thesecond embodiment, a metal film 21 for electromagnetic shielding isformed on the major surface 7 b side of the lid wafer 7. In this case,also, the same effect as in the first embodiment can be obtained. Athrough-hole 20 is also formed on the lid wafer 7, and by performingdicing along the through-holes 17 and 20, dicing can be furtherefficiently performed. For maintaining wafer strength, it is notrequired to provide through-holes 17 and 20 on entire dicing line (backdirection of paper).

When the semiconductor wafer is thinned, the semiconductor wafernormally warps in the direction where the metal film is formed due tothe difference of the coefficient of expansion between the semiconductorwafer and the metal film. In the case of the second embodiment, sincethe warping directions of the body wafer 1 and the lid wafer 7 areopposite, the warpage of each wafer is offset, and the warpage of thewafer after joining can be relieved. In addition, since the groundedmetal film 21 is in the major surface 7 b side of the lid wafer 7, theinterference to the circuit pattern 2 by the grounded metal film 21 canbe reduced.

Third Embodiment

A method for manufacturing a semiconductor device according to the thirdembodiment will be described. FIGS. 19 to 26 are sectional views forillustrating the method for manufacturing a semiconductor deviceaccording to the third embodiment.

First, as shown in FIG. 19, a circuit pattern 2 is formed on the majorsurface 1 a of the body wafer 1.

Next, as shown in FIG. 20, a resist pattern 18 is formed on the majorsurface 7 a of the lid wafer 7. The lid wafer 7 is subjected to etchingusing the resist pattern 18 as a mask. Thereby, a recess 8 is formed onthe major surface 7 a of the lid wafer 7.

Next, as shown in FIG. 21, the recess 8 is made to face to the circuitpattern 2, the semiconductors on the major surface 1 a of the body wafer1 are made to contact the semiconductors on the major surface 7 a of thelid wafer 7, and the lid wafer 7 is joined to the body wafer 1 usingplasma activation joining or the like.

Next, as shown in FIG. 22, the body wafer 1 and the lid wafer 7 arethinned, and chip boundary parts are etched. Next, as shown in FIG. 23,a metal film 21 is formed on the major surface 7 b of the lid wafer 7.

Next, as shown in FIG. 24, a resist pattern 15 is formed on the majorsurface 1 b of the body wafer 1. The body wafer 1 and the lid wafer 7are subjected to etching using the resist pattern 15 as a mask. Thereby,a through-hole 17 penetrating the body wafer 1 and the lid wafer 7 fromthe major surface 1 b of the body wafer 1 and reaching the metal film 21is formed.

Next, as shown in FIG. 25, a metal film 4 is formed on the metal film 21exposed on the major surface 1 b of the body wafer 1, on the inner wallof the through-hole 17, and in the through-hole 17. Since dicing islater performed along the through-hole 17, the through-hole 17 is notfilled with the metal film 4. The metal film 4 on the dicing line can beomitted.

Next, the joined body wafer 1 and lid wafer 7 are subjected to dicingalong the through-hole 17. Thereby, the semiconductor device accordingto the third embodiment is manufactured.

Next, the effect of the third embodiment will be described. In the thirdembodiment, a metal film 21 for electromagnetic shielding is formed inthe major surface 7 b side of the lid wafer 7. In this case, the sameeffect as in the first embodiment can also be obtained. Since the joinedbody wafer 1 and lid wafer 7 are subjected to dicing along thethrough-hole 17, the wafer thickness can be thinned by the thickness thedicing line. Therefore, dicing can be effectively performed whilesecuring the wafer thickness and preventing the dent of the chip. Sinceno thick dicing blade is required, the width of the dicing line can bethinned, and the number of chips per wafer can be increased.

Also in the third embodiment, when the lid wafer 7 is joined to the bodywafer 1, semiconductors are joined. When metals are joined as in thefirst and second embodiments, heating is required depending onconditions or materials. Whereas in the third embodiment, sincesemiconductors have small surface roughness than metals, and the joiningsurfaces between semiconductors can be kept flattened, wafers can bejoined by surface activation at normal temperatures. Therefore, thelowering of throughput due to temperature elevating and lowering can besuppressed.

In the above-described example, although the chip boundary part issubjected to etching for the body wafer 1 and the lid wafer 7 as shownin FIG. 22, only plate thinning without etching may be used as long asstrength can be maintained. For example, as shown in FIG. 26, etching ofthe chip boundary part in the body wafer 1 can be omitted.

Fourth Embodiment

FIG. 27 is a sectional view showing a semiconductor device according tothe fourth embodiment. The semiconductor device is a receiver circuithaving a low-noise amplifier (LNA), a mixer, and an antenna.

A circuit pattern 2 is formed on the major surface 1 a of the body wafer1. The circuit pattern 2 has an LNA and a mixer. A pad 5 forinputting/outputting signals is formed on the major surface 1 b of thebody wafer 1. The circuit pattern 2 is connected to the pad 5 forinputting/outputting signals by the penetrating electrode 6 penetratingthe body wafer 1. In addition, although not shown in the drawing,penetrating electrodes and pads for circuit grounding are also formed.

A recess 8 is formed on the major surface 7 a of the lid wafer 7. Acircuit pattern 22 is formed in the recess 8 of the lid wafer 7. The lidwafer 7 is joined to the body wafer 1 by facing the recess 8 to thecircuit pattern 2. The body wafer 1 is joined to the lid wafer 7 by eachother's semiconductors.

The circuit pattern 2 and the circuit pattern 22 are connected by bumps23. The circuit pattern 24 is formed on the major surface 7 b of the lidwafer 7. The circuit pattern 24 has an antenna. The circuit pattern 22and the circuit pattern 24 are connected by the penetrating electrode 25penetrating the lid wafer 7. A through-hole 26 is formed so as tofacilitate dicing in the same manner as in the first embodiment.

Next, the effect of the fourth embodiment will be described. In thepresent embodiment, circuit patterns 2, 22, and 24 can bethree-dimensionally laminated, the chip size can be more reduced thanthe device wherein the circuit pattern on the two-dimensionally plane.

Particularly in the millimeter wave band, the loss of signal strengthbetween the antenna and the LNA is increased corresponding to wiringlength. Whereas in the present embodiment, the distance between them isshortened in comparison with the device wherein they are connected by awire, the loss can be minimized. Although a GaAs substrate is frequentlyused in high-frequency circuits, when GaAs substrate, which is asemi-insulating substrate, is used, loss can be suppressed in comparisonwith a Si substrate.

In order to further reduce the signal loss in the entire chip, all thepenetrating electrodes through which high-frequency signals are passedare preferably short. Therefore, the body wafer 1 and the lid wafer 7are preferably thin. Although the wafer is thinned, since the bumps 23function as supports, the dent of the chip can be suppressed.Furthermore, when the wafer is thinned, since the distance with theadjacent line can be narrowed, a high-density layout can be obtained.Therefore, the improvement of reception properties owing to decreasedloss and the reduction of the chip size can be simultaneously achieved.

In addition, if an oscillator, a power amplifier, and a switch areformed in the circuit pattern 2, a receiver-transmitter can also becomposed by a body wafer 1 alone. Heretofore, since the circuit chip andthe antenna chip were separated, the assembly had to be performed one byone. In the present embodiment, a receiver-transmitter having both acircuit and an antenna can be formed only by joining wafers to eachother to be subjected to dicing, and thereby the time and costs requiredfor assembly can be significantly reduced.

In addition, if the isolation of the circuit pattern 2 of the body wafer1 and the circuit pattern 22 of the lid wafer 7 is poor, a groundinglayer can be provided in the recess 8. In order to strengthenelectromagnetic shielding properties, a metal film may be formed in thethrough-hole 26 by plating or the like.

Fifth Embodiment

FIG. 28 is a sectional view showing a semiconductor device according tothe fifth embodiment. FIG. 29 is a circuit diagram of a semiconductordevice according to the fifth embodiment. Three lid wafers 27, 28, and29 are laminated on a body wafer 1. The configurations of the lid wafer27, 28, and 29 are same as the configuration of the lid wafer 7 in thefourth embodiment. An oscillator circuit 30 is formed on the body wafer1; a mixer circuit 31 is formed on the lid wafer 27; an LNA circuit 32is formed on the lid wafer 28; and an antenna 33 is formed on the lidwafer 29.

The high-frequency signals RF received using the antenna 33 are inputtedinto the LNA circuit 32 via the bump 23, the penetrating electrode 25and the like. The high-frequency signals RF are amplified by the LNAcircuit 32, and inputted into the mixer circuit 31. The localoscillation signals LO required for mixer operation are generated in theoscillator circuit 30, and inputted into the mixer circuit 31. Theintermediate frequency signals IF generated in the mixer circuit 31 areoutputted from the major surface 1 b of the body wafer 1 into the motherboard. The direct-current voltage DC is supplied to the transistors inevery layer.

In the present embodiment, since the circuit patterns can bethree-dimensionally laminated, the chip size can be reduced in the samemanner as in the fourth embodiment, and the mounting time and costs canbe greatly reduced. Particularly, in the millimeter wave band, whereinthe circuit properties are sensitive to the assembly accuracy, thisadvantage is significant. In the present embodiment, since four wafersare joined, the respective wafers need to be thinned. In this case,also, since the bump 23 functions as a support, the dent of the chip canbe suppressed.

Sixth Embodiment

FIG. 30 is a sectional view showing a semiconductor device according tothe sixth embodiment. Two lid wafers 34 and 35 are laminated on a bodywafer 1. The configuration of the lid wafer 34 is same as theconfiguration of lid wafer 7 of the fourth embodiment. A metal film 37is formed on the entire inner wall of the recess 36 of the lid wafer 35,and the recess 36 is hollowed to form a waveguide resonator. Since theresonator having a higher Q value than the Q value of the resonator bythe circuit pattern can be constituted on a chip, the oscillationproperties can be improved. Also since circuit patterns can bethree-dimensionally laminated, the chip size can be reduced as in thefourth and fifth embodiments. A dielectric material may be buried in thewaveguide.

Seventh Embodiment

FIG. 31 is a sectional view showing a semiconductor device according tothe seventh embodiment. A transistor 38 is formed on the major surface 1a of a body wafer 1. The transistor 38 has a sub-collector layer 39, acollector layer 40, a base layer 41, an emitter layer 42, a collector43, a base 44, and an emitter 45. Although the transistor 38 is an HBT(hetero-junction bipolar transistor) here, the transistor 38 can be afield effect transistor.

A recess 8 is formed on the major surface 7 a of the lid wafer 7. Agrounding electrode 46 is formed in the recess 8 of the lid wafer 7. Thelid wafer 7 is joined to the body wafer 1 with the recess 8 facing tothe transistor 38. The base 44 and the collector 43 of the transistor 38are connected to the external circuit via the penetrating electrodes 6.

The emitter 45 of the transistor 38 (source in the case of a fieldeffect transistor) and the grounding electrode 46 are connected by abump 47. A radiator 48 is formed on the major surface 7 b of the lidwafer 7. The radiator 48 is grounded. The grounding electrode 46 isconnected to the radiator 48 by the penetrating electrode 49 penetratingthe lid wafer 7.

Thereby, heat dissipation can be improved, and parasitic inductance canbe reduced in comparison with the conventional device wherein theemitter of the HBT is grounded and heat-radiated via the air bridge andthe through-hole of the body wafer. Therefore, gain is much improvedespecially in the millimeter wave band, the heat dissipation is improvedand thereby an output characteristic is also improved.

Eighth Embodiment

FIG. 32 is a plan view showing a semiconductor device according to theeighth embodiment. FIG. 33 is a sectional view taken along the line A-A′in FIG. 32. FIG. 34 is a sectional view taken along the line B-B′ inFIG. 32. FIG. 35 is a sectional view taken along the line C-C′ in FIG.32.

Circuit patterns 50 and 51, a wiring 52, and a metal film 53 are formedon the major surface 1 a of the body wafer 1. The circuit pattern 50 andthe circuit pattern 51 are connected by the wiring 52. The circuitpattern 50 has an oscillator and a switch. The circuit pattern 51 has anamplifier. A grounding pad 54 is formed on the major surface 1 b of thebody wafer 1. The metal film 53 and the grounding pad 54 are connectedby a penetrating electrode 55.

Recesses 56 and 57 are formed on the major surface 7 a of the lid wafer7. A metal film 58 is formed in the recess 56 of the lid wafer 7. Thelid wafer 7 is joined to the body wafer 1 by facing the recess 56 to thecircuit pattern 50 and facing the recess 57 to the circuit pattern 51.Here, semiconductors are joined to one another on the ends of the chip;and the metal film 58 and the metal film 53 are joined inside the chip.The metal film 58 formed in the recess 56 of the lid wafer 7 is groundedvia the metal film 53, the penetrating electrode 55, and the groundingpad 54.

The major surface 7 a of the lid wafer 7 has a region 59 joined to thebody wafer 1, and a region 60 present between the recess 56 and therecess 57, and facing to the wiring 52. The region 60 sags downwardsthan the region 59. The difference d of the height between the region 60and the region 59 is larger than the thickness t of the wiring 52.Therefore, the region 60 separates from the wiring 52.

Next, a method for manufacturing a semiconductor device according to theeighth embodiment will be described. FIGS. 36 to 43 are sectional viewsfor illustrating the method for manufacturing a semiconductor deviceaccording to the eighth embodiment. Here, FIGS. 36 to 40 and FIG. 43correspond to FIG. 33, FIG. 41 corresponds to FIG. 34, and FIG. 42corresponds to FIG. 35.

First, as shown in FIG. 36, circuit patterns 50, 51, and a wiring 52 areformed on the major surface 1 a of the body wafer 1. Furthermore, apenetrating electrode 55 and a grounding pad 54 are formed.

Next, as shown in FIG. 37, recesses 56 and 57 are formed on the majorsurface 7 a of the lid wafer 7. Next, as shown in FIG. 38, a metal film58 is formed in the recess 56 of the lid wafer 7. Then, as shown in FIG.39, a recess 61 is formed on the major surface 7 b of the lid wafer 7.

Next, as shown in FIGS. 40 to 42, the recess 56 is made to face to thecircuit pattern 50 and the recess 57 is made to face to the circuitpattern 51, and the lid wafer 7 is joined to the body wafer 1. Next, asshown in FIG. 43, the joined body wafer 1 and lid wafer 7 are subjectedto dicing along the recess 61. Thereby, the semiconductor deviceaccording to the eighth embodiment is manufactured.

Next, the advantage of the eighth embodiment will be described. Sincethe metal film 58 of the lid wafer 7 covering the circuit pattern 50 isgrounded, the electromagnetic shield effect can be improved, and theexternal electromagnetic noise can be prevented. Furthermore, undesiredoscillation or the misaligned oscillation frequency can be suppressed.

In the present embodiment, since the amplifier and the oscillator areformed on a chip, the device size and the manufacturing costs can bereduced in comparison with the device wherein the amplifier and theoscillator are formed on separate chips. In addition, although theamplifier and the oscillator can be separated by making the intermediatelayer in the fifth embodiment to be a grounding electrode, the presentembodiment is effective because a layer is added for electromagneticshielding.

In addition, the region 60 present between the recess 56 and the recess57 on the major surface 7 a of the lid wafer 7 is separated from thewiring 52. Therefore, the wiring 52 that connects the circuit pattern 50to the circuit pattern 51 is not joined with the lid wafer 7.Consequently, the signals generated by the oscillator are inputted tothe amplifier.

Since the joined body wafer 1 and the lid wafer 7 are subjected todicing along the recess 61, the wafer thickness can be thinned by thedicing line. Therefore, dicing can be efficiently performed whilesecuring the wafer thickness and preventing the dent of the device. Inaddition, since a thick dicing blade is not required, the width of thedicing line can be reduced, and the number of chips per wafer can beincreased.

In the above-described first to eighth embodiments, dicing with a dicingblade is used as the method for separating a wafer into respectivechips. However, the method is not limited to dicing, and other methodsfor separating the chip, such as scribing and laser fusing, can also beused.

Obviously many modifications and variations of the present invention arepossible in the light of the above teachings. It is therefore to beunderstood that within the scope of the appended claims the inventionmay be practiced otherwise than as specifically described.

The entire disclosure of a Japanese Patent Application No. 2010-170570,filed on Jul. 29, 2010 including specification, claims, drawings andsummary, on which the Convention priority of the present application isbased, are incorporated herein by reference in its entirety.

1. A method for manufacturing a semiconductor device comprising: forminga circuit pattern and a first metal film on a first major surface of abody wafer having the first major surface and a second major surfacefacing the first major surface; forming a through-hole penetrating thebody wafer from the second major surface of the body wafer and reachingthe first metal film; forming a second metal film on a part of thesecond major surface of the body wafer, on an inner wall of thethrough-hole, and on the first metal film exposed in the through-hole;forming a recess on a first major surface of a lid wafer having thefirst major surface of the lid wafer and a second major surface facingthe first major surface of the lid wafer; forming a third metal film onthe first major surface, including inside the recess, of the lid wafer;with the recess facing the circuit pattern, and the first metal filmcontacting the third metal film, joining the lid wafer to the bodywafer; and dicing the joined body wafer and lid wafer along thethrough-hole.
 2. A method for manufacturing a semiconductor devicecomprising: forming a circuit pattern and a first metal film on a firstmajor surface of a body wafer having the first major surface and asecond major surface facing the first major surface; forming a firstthrough-hole penetrating the body wafer from the second major surface ofthe body wafer and reaching the first metal film; forming a second metalfilm on a part of the second major surface of the body wafer, on aninner wall of the first through-hole, and on the first metal filmexposed in the first through-hole; forming a recess on a first majorsurface of a lid wafer having the first major surface of the lid waferand a second major surface facing the first major surface of the lidwafer; forming a third metal film on the first major surface of the lidwafer; forming a second through-hole penetrating the lid wafer from thesecond major surface of the lid wafer and reaching the third metal film;forming a fourth metal film on the second major surface of the lidwafer, on an inner wall of the second through-hole, and on the thirdmetal film exposed in the second through-hole; with the recess facingthe circuit pattern, aligning the first through-hole with the secondthrough-hole, and with the first metal film contacting the third metalfilm, joining the lid wafer to the body wafer; and dicing the joinedbody wafer and lid wafer along the first and second through-holes.
 3. Amethod for manufacturing a semiconductor device comprising: forming acircuit pattern on a first major surface of a body wafer having thefirst major surface and a second major surface facing the first majorsurface; forming a recess on a first major surface of a lid wafer havingthe first major surface of the lid wafer and a second major surfacefacing the first major surface of the lid wafer; with the recess facingthe circuit pattern, and a semiconductor on the first major surface ofthe body wafer contacting a semiconductor on the first major surface ofthe lid wafer, joining the lid wafer to the body wafer; forming a firstmetal film on the second major surface of the lid wafer; forming athrough-hole penetrating the joined body wafer and lid wafer from thesecond major surface of the body wafer and reaching the first metalfilm; forming a second metal film on the second major surface of thebody wafer, on an inner wall of the through-hole, and on the first metalfilm exposed in the through-hole; and dicing the joined body wafer andlid wafer along the through-hole.
 4. A semiconductor device comprising:a body wafer having a first major surface and a second major surfacefacing the first major surface; a first circuit pattern on the firstmajor surface of the body wafer; a lid wafer which has a first majorsurface and a second major surface facing the first major surface of thelid wafer, a recess on the first major surface of the lid wafer facingthe first circuit pattern, the lid wafer being joined to the body wafer;a second circuit pattern in the recess of the lid wafer; a bumpconnecting the first circuit pattern to the second circuit pattern; athird circuit pattern on the second major surface of the lid wafer; anda penetrating electrode penetrating the lid wafer and electricallyconnecting the second circuit pattern to the third circuit pattern.
 5. Asemiconductor device comprising: a body wafer having a first majorsurface and a second major surface facing the first major surface; atransistor on the first major surface of the body wafer; a lid waferwhich has a first major surface and a second major surface facing thefirst major surface of the lid wafer, a recess on the first majorsurface of the lid wafer facing the transistor, the lid wafer beingjoined to the body wafer; a grounding electrode in the recess of the lidwafer; a bump connecting an emitter or a source of the transistor to thegrounding electrode; a radiator on the second major surface of the lidwafer; and a penetrating electrode penetrating the lid wafer andelectrically connecting the grounding electrode to the radiator.
 6. Asemiconductor device comprising: a body wafer having a first majorsurface and a second major surface facing the first major surface; afirst circuit pattern and a second circuit pattern on the first majorsurface of the body wafer; a lid wafer which has a first major surfaceand a second major surface facing the first major surface of the lidwafer, a first recess on the first major surface of the lid wafer facingthe first circuit pattern, a second recess on the first major surface ofthe lid wafer facing the second circuit pattern, the lid wafer beingjoined to the body wafer; and a metal film in the first recess of thebody wafer.
 7. The semiconductor device according to claim 6, furthercomprising a wiring on the first major surface of the body wafer andelectrically connecting the first circuit pattern to the second circuitpattern, wherein the first major surface of the lid wafer has a firstregion joined to the body wafer, and a second region which is betweenthe first recess and the second recess and faces to the wiring, thesecond region sags downwards more than the first region, heightdifference between the first region and the second region is larger thanthickness of the wiring, and the second region is separated from thewiring.
 8. A method for manufacturing a semiconductor device comprising:forming a first circuit pattern and a second circuit pattern on a firstmajor surface of a body wafer having the first major surface and asecond major surface facing the first major surface; forming first andsecond recesses on a first major surface of a lid wafer having the firstmajor surface of the lid wafer and a second major surface facing thefirst major surface of the lid wafer; forming a metal film in the firstrecess of the lid wafer; forming a third recess on the second majorsurface of the lid wafer; with the first recess facing the first circuitpattern, and the second recess facing the second circuit pattern,joining the lid wafer to the body wafer; and dicing the joined bodywafer and lid wafer along the third recess.